14860 Circuit Card Assembly

Statement of Work (SOW) / Performance Work Statement (PWS)

This Performance Work Statement (PWS) outlines the requirements for obtaining electronic parts and products, specifically Printed Circuit Board Assemblies (PCBAs), through a turn-key solution for Printed Circuit Board (PCB) Fabrication and Assembly. The goal is to support Department of War (DoW) programs by rapidly producing PCBAs for initial design and development, prototyping for design validation, and manufacturing high-quality PCBAs for operational environments. This PWS supports missions such as the 516th Common Aircraft Portable Reprogrammable Equipment (CAPRE) and similar systems.

• PCB Fabrication: Contractors shall fabricate PCBs according to specified requirements, including board thickness, layer count, surface finish, and trace tolerance. Fabrication must adhere to IPC-A-600 classification, or IPC Class 3 if not specified. Technical reports on electrical continuity, impedance matching, and quality control inspections are required.

• Component Procurement: Contractors shall procure necessary electronic components, using authorized distributors or OEMs. Alternative sources require Government approval. A 30-day window is provided for order execution to manage supply chain disruptions. Suitable alternates for unavailable or long lead-time components must be identified and approved by Government SMEs.

• PCBA Assembly: Contractors shall assemble PCBAs according to layout specifications and assembly requirements, adhering to J-STD-001 and IPC-A-610 classification (or IPC Class 2 if not specified). Technical reports documenting electrical continuity and quality control inspections are required. Tin-Lead solder is generally required unless otherwise specified.

• PCB Fabrication: All PCBs fabricated must meet IPC Class 3 (or as specified) with documented evidence of circuit continuity.

• Component Procurement: All components must be procured from authorized distributors or Government-approved sources.

• PCBA Assembly: All PCBAs assembled must meet IPC Class 2 (or as specified) with documented evidence of QC inspections.

• Place of Performance: The contractor's facility.

• Period of Performance: 60 months (one base year plus four option years), commencing upon BPA acceptance.

• Government Furnished Equipment (GFE): The Government may provide electronic components, identified on a Government Furnished Material (GFM) list. Contractors must review GFM suitability and request additional information within 5 days of receipt.

• Data Rights: The U.S. Government retains unlimited data and computer software rights.

• Quality Control Plan (QCP): Contractors must establish a QCP.

• Conflicts of Interest: Contractors must avoid conflicts of interest.

• Excess Materials: All excess PCB materials and components must be returned to the Government upon completion, unless an agreement for inventory is made for follow-on orders.

Solicitation / RFP / RFQ

This document outlines the evaluation factors for a solicitation seeking qualified and capable Printed Circuit Board Assembly (PCBA) firms. The government aims to establish a pool of qualified suppliers through Basic Purchasing Agreements (BPAs) to deliver rapid PCBA units. Pricing information is not requested at this time; fair and reasonable prices will be determined for individual orders.

Technical capability will be evaluated on an acceptable/unacceptable basis, focusing on the offeror's ability to perform the following:

• PCB Assembly and/or PCB Fabrication in-house.

• A wide range of PCB Fabrication activities, including multi-layer, multi-sided, very thin PCBs, high-density features, and complex vias.

• PCB Fabrication validation and quality control, including post-production impedance and continuity checks.

• A wide range of PCB Assembly activities, including multi-sided, very small/thin assemblies, high component density, fine pitch components (BGAs, BTCs), and miniscule passive components (0201, 01005).

• PCB Assembly validation and quality control, including post-production inspections and electrical tests.

• Rapid procurement of electronic components to meet tight production deadlines, especially when Government Furnished Material (GFM) is absent.

• Perform orders with International Trafficking in Arms (ITAR) requirements.

• Perform orders with Trusted Requirements (DoDI 5200.44).

• Provide a Quality Control plan as stated in the PWS.

• The solicitation will result in Basic Purchasing Agreements (BPAs).

• Factor 1: Technical Acceptability

  • Evaluated on an acceptable/unacceptable basis.
  • Requires offerors to demonstrate capabilities in PCB Fabrication, Assembly, Quality Control, Component Procurement, and ITAR compliance.
  • Specific criteria include in-house fabrication/assembly, layer count, PCB thickness, feature density, component types, and quality control processes.
  • Offerors must provide capability lists detailing processes, equipment, and technical knowledge.

• Factor 2: Past Performance Relevance and Confidence Assessment

  • Evaluated based on the offeror's past performance record and the government's confidence in their ability to perform.
  • Relevancy ratings include Very Relevant, Relevant, Somewhat Relevant, and Not Relevant.
  • Confidence assessments include Substantial, Satisfactory, Neutral, and Limited Confidence.

• Offerors must demonstrate ITAR capabilities.

• Pricing information is not requested at this time.

• Fair and reasonable prices will be determined for individual orders.

• The PWS (Attachment 1) provides further details on requirements.

Solicitation / RFP / RFQ

This document provides "Instructions to Offerors" for commercial products and services, specifically detailing the requirements for submitting offers related to Printed Circuit Board Assembly (PCBA) and Fabrication.

Offerors must demonstrate in-house capabilities for:

• PCB assembly and/or fabrication.

• Performing a wide range of PCB fabrication activities, including multi-layer, multi-sided, very thin, high-density, and complex via PCBs.

• Performing and reporting on PCB fabrication validation and quality control.

• Performing a wide range of PCB assembly activities, including multi-sided, very small/thin assemblies, high component density, fine pitch (BGAs, BTCs), and miniscule passive components (0201, 01005).

• Performing and reporting on PCB assembly validation and quality control.

• Rapidly providing/procuring electronic components, including describing the chain of custody from OEM when Government Furnished Material is absent.

• Performing orders with International Trafficking in Arms (ITAR) requirements.

• Performing orders with Trusted Requirements (DoDI 5200.44).

• Offers must be held firm for 60 calendar days from the specified receipt date.

• The Government intends to evaluate offers and award a contract without exchanges, meaning initial offers should be the best terms.

• Offers must be submitted by the exact time specified.

• Minimum submission requirements include solicitation number, offeror's name/address/phone, UEI, and EFT indicator.

• Proposals will be evaluated on Technical Volume (Factor 1) and Past Performance Volume (Factor 2).

• Technical Volume (limited to 5 pages) must demonstrate in-house capabilities as detailed above.

• Past Performance Volume (limited to 3 pages per contract/order) should include details of recent (within 3 years) completed or substantially accomplished government or commercial contracts/orders relevant to the solicitation's scope.

• Offerors must also provide responses to required representations and certifications and a statement of agreement with all terms and conditions.

Not explicitly stated in this section, but ITAR and Trusted Requirements are mentioned.

• Proposal preparation costs are the sole responsibility of the offeror.
• The Government may reject any or all offers, accept other than the lowest offer, and waive informalities.

Solicitation / RFP / RFQ

This document is a Combined Synopsis/Solicitation for a Blanket Purchase Agreement (BPA) to establish a streamlined procurement and manufacturing vehicle for high-quality Printed Circuit Board Assemblies (PCBAs) and Circuit Card Assemblies (CCAs). The purpose is to support design, prototyping, and operational use, addressing Department of War (DoW) electronic obsolescence and modernization needs.

• Production and manufacturing of PCBAs and CCAs.

• Support for design, prototyping, and operational use.

• Addressing electronic obsolescence and modernization.

• Type: Blanket Purchase Agreement (BPA).

• Period of Performance: Five (5) years.

• Funding: Funds will be obligated by individual Calls/Orders, not by the BPA itself. The Government is only obligated to the extent of authorized purchases.

• Dollar Limitation: Each individual BPA call/order shall not exceed $350,000.00.

• Submission Method: Offers must be submitted electronically.

• Submission Deadline: Wednesday, 24 June 2026, no later than 10:00 AM (MT).

• Evaluation Factors: Detailed in Attachment 3 (Commercial Products and Commercial Services).

• Instructions: Detailed in Attachment 2 (Commercial Instructions to Offerors).

• This acquisition is a small business set-aside.

• Applicable NAICS Code: 334418.

• Small Business Size Standard: 750 employees.

• A separate written solicitation will not be issued.

• Only individuals designated by the Contracting Officer are authorized to place orders or make purchases under this BPA.

• The BPA will be reviewed at least annually by the Government.

• Attachment 1 is the 14860 Circuit Card Performance Work Statement.