ADaPT Gen III PCB Fabrication/Assembly

Solicitation / RFP / RFQ

This document is a Request for Quotation (RFQ) for the ADaPT Gen III PCB Fabrication/Assembly. The solicitation outlines the requirements for procuring these services from responsible offerors.

• The specific Statement of Work (SOW) and Bid Schedule are detailed in Section 1.

• Offerors must comply with all terms and conditions, including those incorporated by reference.

• Specific clauses related to commercial items, duty-free entry, place of manufacture, export licenses, and government property are included.

• The contract type is Firm Fixed-Priced (TBD).

• Delivery is FOB Destination.

• Quotes are due by June 3, 2026, at 4:00 p.m. CT.

• Quotes must be submitted via email to Lindsey McLellan at lindsey.m.mclellan@nasa.gov.

• Quotes shall remain valid for 30 days.

• Contractual and technical questions must be submitted in writing (email) to Lindsey McLellan by June 1, 2026, at 4:00 p.m. CT.

• The Government will award the contract to the responsible Offeror whose offer is the lowest price technically acceptable (LPTA).

• Offers not deemed technically acceptable will be removed from consideration.

• This procurement is set aside for small business.

• Offerors must be registered at www.sam.gov.

• The North American Industry Classification System (NAICS) Code for this procurement is 541330.

• The solicitation includes sections on Statement of Work/Bid Schedule, Instructions to Offerors, Solicitation Provisions/Representations and Certifications, Clauses/Terms and Conditions, and Quote Evaluation Criteria.

Statement of Work (SOW) / Performance Work Statement (PWS)

This document outlines the requirements for the fabrication and assembly of the ADAPT Gen III Printed Circuit Board (PCB).

• Fabrication and assembly of the ADAPT Gen III Antenna PCB.

• The PCB design utilizes specialized microwave PCB substrates with specific via and trace geometry for optimal antenna performance.

• Design files will be provided by NASA.

• It is recommended that a single vendor perform both fabrication and assembly to minimize risks.

• Material stack-up and geometry tolerances for via size and trace geometry are critical cost drivers.

• Detailed material specifications, including dielectric type, thickness, and electrical properties (Dk, Df), are provided for various layers (e.g., GND, Dielectric, RF, Power, Feed).

• Specific details on vias, including types (e.g., Thru, µVia, Blind) and their corresponding layer connections, are outlined.

• Mechanical drawings and via details are included as examples.

• Handling of all parts and assemblies must be done with clean, lint-free, anti-static gloves or finger cots.

• Components must be demoisturized (baked) for a minimum of 2 hours at 93°C ± 5.5°C before soldering.

• Soldering should be performed immediately after baking or parts stored in appropriate static dissipative packaging.

• Assembly and soldering must adhere to IPC-610 Class standards.

• Surface mount (SMT) parts must be installed and soldered before through-hole parts.

• Lead-based, no-clean solder formula is to be used.

• Completed assemblies require specific marking with PIN and SIN.

• Passive component part numbers are subject to change based on market availability, but any alternates must conform to the original part's form factor.

• The System Design Engineer will approve the final Bill of Materials (BOM).

• Assemblies must be packaged in clean, static dissipative packaging and identified by tagging with project reference, brand, and serial/lot number.

Not explicitly stated in this document, but implies fabrication and assembly will occur at the contractor's facility.