NOTICE OF INTENT-BMF HF Vapor Etcher

Quick Summary

The National Institute of Standards and Technology (NIST), Acquisition Management Division, intends to negotiate on a sole-source basis with Idonus Sarl (Cage: SCH63), located in Switzerland, for a BMF HF Vapor Etcher. This notice of intent seeks to identify any other responsible sources capable of meeting the specified requirements. Responses are due by May 19, 2025, at 5:00 p.m. MT.

Scope of Work

NIST's Boulder Microfabrication Facility (BMF) requires a new HF vapor etcher to perform various etching processes in the Precision Measurement Laboratory. The new system must accept substrates up to SEMI spec 150 mm wafers, as the current system is limited to 100 mm wafers. Key requirements for the HF Vapor Etch Unit include:

• Safety: Must meet industry standards for HF safety, use liquid HF as a vapor source (not HF gas), and be compatible with approximately 48% HF in water.
• Capacity: Capable of etching substrates from 5x5 mm chips up to 150 mm wafers, with a preference for systems offering an electrostatic chuck.
• Performance: SiO2 etch rate of 3-30 um/hour, etch uniformity typically 90% (50% guaranteed with a 3mm exclusion zone), and substrate heating to 35-60°C.
• Design: Designed for safe operation, minimizing user interaction with HF, and ensuring substrates are dry and residue-free.
• Physical Dimensions: Process unit approximately 25 cm x 40 cm x 25 cm (W x L x H), control electronics within 30 cm x 30 cm x 10 cm (W x L x H).
• Eligibility: All items must be new; used, remanufactured, experimental, prototype, custom, or "gray market" items are not acceptable.
• Trade-in Option: An option for a trade-in credit for the Government's existing Idonus VPE 100 system is requested.

Contract & Timeline

• Type: Special Notice (Notice of Intent for Sole Source)
• Anticipated Award Type: Firm-Fixed-Price Purchase Order
• Set-Aside: None (Sole Source Justification)
• NAICS: 334516 – Analytical Laboratory Manufacturing (Size Standard: 1,000 employees)
• Period of Performance: 1 year After Receipt of Order (ARO)
• Delivery: F.O.B. Destination to NIST Boulder, CO
• Response Due: May 19, 2025, at 5:00 p.m. MT
• Estimated Award: By June 2026 (if competitive procedures are not used)
• Published: May 8, 2026

Justification for Other Than Full and Open Competition

The sole source determination is based on the critical need for a system that meets specific technical requirements and safety concerns related to HF vapor etching. While many companies offer HF systems, NIST requires a liquid etcher for safety reasons due to the extreme toxicity of HF. The current system cannot handle 150 mm wafers, which are essential for new fabrication processes. Without this procurement, critical NIST research activities would be forced to stop.

Submission & Evaluation

Interested parties must clearly and unambiguously identify their capability to satisfy the requirements in writing. Information submitted will solely determine if competitive procedures could be used.

• Inspection and Acceptance: Government will inspect and may perform performance tests (SiO2 etch rate and uniformity on a 150mm wafer) within 30 days of receipt. Acceptance is contingent upon meeting all specified performance requirements.
• Warranty: Minimum 1-year warranty for labor, parts, and the entire system after acceptance.
• Payment: 100% payment after installation, acceptance, successful completion of testing, and submission of a proper invoice.

Additional Notes

This notice of intent is not a solicitation. Questions and responses must be submitted via email to angela.hitt@nist.gov. The contractor must confirm shipment with the Designated Government Official and Contracting Officer due to limited site access. Partial shipments and invoices are not accepted unless approved.