Direct Bonding for Compound Semiconductor for Use in Dual Band Infrared Focal Plane Arrays
Overview
Buyer
Place of Performance
NAICS
PSC
Set Aside
Original Source
Timeline
Qualification Details
Fit reasons
- NAICS alignment with historical contract wins in similar service areas.
- Scope strongly matches core technical capabilities and delivery model.
Risks
- Past performance thresholds may require one additional teaming partner.
- Potential clarification needed on staffing minimums before bid/no-bid.
Next steps
Validate eligibility requirements, assign capture owner, and schedule partner outreach to confirm teaming strategy before submission planning.
Quick Summary
The Department of the Army has issued an Award Notice for a sole source procurement to DRS Network & Imaging Systems, LLC. for Direct Bonding for Compound Semiconductor for Use in Dual Band Infrared Focal Plane Arrays. This effort aims to develop and implement direct bonding techniques to eliminate epoxy in FPA production, improving sensitivity and yield. The contract is a Cost-Plus-Fixed-Fee (CPFF) with an estimated ceiling of $8.4 million over 36 months.
Scope of Work
This acquisition focuses on:
- Developing and implementing direct bonding (DB) techniques to remove or reduce infrared absorbing epoxy.
- Creating a manufacturing process to repurpose non-specification dual-band Infrared (IR) FPAs as High Definition Long Wave (HDLW) FPAs.
- Designing, fabricating, and testing FPAs using direct bond hybridization (DBH) with a common IR-transparent material interface (e.g., ZnS).
- Key deliverables include the DBH process and a manufacturing process for HDLW FPAs.
Contract Details
- Contract Type: Cost-Plus-Fixed-Fee (CPFF)
- Estimated Ceiling: $8.4 million
- Period of Performance: 36 Months
- Funding Source: Research, Development, Test and Evaluation (RDT&E) FY26-28 Mantech funding
- Awardee: DRS Network & Imaging Systems, LLC.
- Published Date: May 27, 2026
Eligibility & Justification
This procurement is justified as a sole source award to DRS Network & Imaging Systems, LLC., based on their unique capabilities and expertise. The authority cited is Title 10 United States Code Section 3204(a)(1) and FAR 6.302-1(a)(2)(ii)(A). Market research, including a Sources Sought announcement and RFI, indicated that only DRS possesses the necessary capabilities. Subcontracting requirements include the utilization of Small Business Concerns and adherence to Small Business Subcontracting Plans.
Additional Notes
This is an award notice and justification for a sole source, not a solicitation for proposals. However, all notices required by FAR 5.201(b)(1)(i) will be published, and any proposals received will be considered. This effort is expected to benefit programs such as 3GEN FLIR, Distributed Aperture Infrared Countermeasure (DAIRCM), and Standard Missile 3 (SM3).