PCB Fabrication - 15 boards with assemblies labor and components.

SOL #: N00173-26-Q-1301329302Combined Synopsis/Solicitation

Overview

Buyer

Dept Of Defense

Dept Of The Navy

NAVAL RESEARCH LABORATORY

WASHINGTON, DC, 20375-5328, United States

Place of Performance

Washington, DC

NAICS

Bare Printed Circuit Board Manufacturing (334412)

PSC

Specialized Semiconductor, Microcircuit, And Printed Circuit Board Manufacturing Machinery (3670)

Set Aside

Total Small Business Set-Aside (FAR 19.5) (SBA)

Original Source

https://sam.gov/opp/1af72dfe468f4807b6a4562551952055/view

Timeline

Posted

Feb 26, 2026

Last Updated

Mar 20, 2026

Submission Deadline

Mar 27, 2026, 11:00 AM

Qualification Details

Fit reasons

NAICS alignment with historical contract wins in similar service areas.
Scope strongly matches core technical capabilities and delivery model.

Risks

Past performance thresholds may require one additional teaming partner.
Potential clarification needed on staffing minimums before bid/no-bid.

Next steps

Validate eligibility requirements, assign capture owner, and schedule partner outreach to confirm teaming strategy before submission planning.

Quick Summary

The Naval Research Laboratory (NRL) is soliciting quotations for PCB Fabrication, Assembly Labor, and Components for 15 "Console_pwr_int (interconnect)" boards. This opportunity is a Total Small Business Set-Aside and will be awarded based on the Lowest Price Technically Acceptable (LPTA) method. Quotations are due by March 27, 2026, at 11:00 AM EST.

Scope of Work

The requirement is for the purchase of 15 units each of:

PCB Fabrication (Q1668149-1D)
Assembly Labor (Q1668149-1E)
Components (Q1668149-1F) for the "Console_pwr_int (interconnect)" board. The boards must be fabricated to detailed specifications, including:
Material: Epoxy Glass Laminate to IPC 4101/24, 93 mil finished panel thickness.
Standards: IPC-A-600 Class 2 and IPC-6012 Class 2.
Finishes: Immersion Gold/Electroless Nickel, Immersion Silver, or Immersion Tin, with specific thickness requirements. Finger connectors require 35 um electrolytic gold plating.
Other: Blue solder resist, white component identification, 2oz copper weight on all layers. Vendors must be an Original Equipment Manufacturer (OEM) or an authorized dealer/distributor/reseller, providing manufacturer documentation of authorization.

Contract & Timeline

Type: Combined Synopsis/Solicitation (RFQ) for Commercial Items
Set-Aside: Total Small Business Set-Aside (FAR 19.5)
NAICS: 334412 (Printed Circuit Board Manufacturing)
PSC: 3670 (Specialized Semiconductor, Microcircuit, And Printed Circuit Board Manufacturing Machinery)
Response Due: March 27, 2026, 11:00 AM EST
Published: March 20, 2026
Delivery: To multiple NRL locations including Washington, DC; Monterey, CA; and Stennis Space Center, MS. FOB Destination is the preferred method.

Evaluation Factors

Award will be made to the responsible offeror whose offer is most advantageous to the Government, based on Lowest Price Technically Acceptable (LPTA). Offers will be ranked by price, and the lowest-priced offer(s) will be technically evaluated. Technical acceptability requires meeting all minimum requirements and specifications. Award may be made without discussions.

Submission Requirements

Quoters must submit one copy of their technical and price quote via email to the Government Point of Contact. Submissions must include the company's DUNS Number and CAGE Code. Offerors must have an active registration in the System for Award Management (SAM) database. A statement regarding the acceptance of terms and conditions is required.