This is a Combined Sources Sought/Notice of intent to acquire Semiconductor market research services
Overview
Buyer
Place of Performance
NAICS
PSC
Set Aside
Original Source
Timeline
Qualification Details
Fit reasons
- NAICS alignment with historical contract wins in similar service areas.
- Scope strongly matches core technical capabilities and delivery model.
Risks
- Past performance thresholds may require one additional teaming partner.
- Potential clarification needed on staffing minimums before bid/no-bid.
Next steps
Validate eligibility requirements, assign capture owner, and schedule partner outreach to confirm teaming strategy before submission planning.
Quick Summary
The National Institute of Standards and Technology (NIST) has issued a Combined Sources Sought and Notice of Intent to Sole Source for Semiconductor market research services. This notice seeks to identify alternative sources capable of providing a software subscription for market research to support the CHIPS Research and Development (R&D) Office and Open Broad Agency Announcement (BAA). If no alternate sources are identified, NIST intends to award a sole source contract to Markets and Markets Research Private Limited. Responses are due by April 27, 2026, at 8:00 a.m. Eastern Time.
Scope of Work
NIST requires a software subscription for Semiconductor market research services that provides information on specific, niche markets and broader technological areas. This includes data on total addressable markets, Compound Annual Growth Rate (CAGR), geographic location, competitors, and trends. The service must also provide research and analytical data on global venture capital to assess security risks (e.g., foreign investments, foreign-owned shell companies) for CHIPS R&D programs.
Key technical characteristics required include:
- Granular Material-Level Segmentation: Deep-dive quantification of the semiconductor packaging materials market (e.g., organic substrates, bonding wires, encapsulation resins, thermal interface materials).
- Techno-Commercial Ecosystem Mapping: Platform mapping the convergence of 5G, AI, and Advanced Packaging, identifying major players and niche Tier 2/3 suppliers.
- Proprietary Patent & Trade Analysis: Integration of patent publication trends and trade (import/export) data into semiconductor reports.
- Micro-Market Forecasting: CAGR data for emerging niche technologies like Fan-Out Wafer-Level Packaging (FOWLP) and High-Bandwidth Memory (HBM) materials.
Contract & Timeline
- Type: Sources Sought / Notice of Intent to Sole Source
- NAICS: 519290 Web Search
- Set-Aside: None specified (market research stage)
- Response Due: April 27, 2026, 8:00 a.m. ET
- Published: April 17, 2026
Response Requirements
Interested parties should submit responses via email to Prateema Carvajal (prateema.carvajal@nist.gov) and Monica Brown (monica.brown@nist.gov). Responses should be in Microsoft Word 365, Excel 365, or PDF format and include:
- Company name, address, contact information, and UEI (if registered in SAM.gov).
- Details on capabilities meeting or exceeding NIST's requirements.
- Evidence of authorized reseller status, if applicable.
- Identification of any unduly restrictive requirements and suggestions for small business participation.
- Small business status and alternative NAICS code suggestions.
- Existing Federal Supply Schedule contract numbers or other relevant contracts.
- Experience providing similar products or services.
- Any other valuable information for market research.
- Indication of interest in engaging for further understanding.
Additional Notes
This notice is for market research and planning purposes only and does not constitute a commitment to issue a solicitation or award a contract. Responses will not be considered proposals or quotations, and no award will be made as a result of this notice. NIST will not reimburse costs incurred by respondents. Questions regarding this notice must be submitted by April 27, 2026, 8:00 a.m. ET.