TPT Manual Wire Bonder

SOL #: NIST-SS26-09Sources Sought

Overview

Buyer

Commerce
National Institute Of Standards And Technology
DEPT OF COMMERCE NIST
GAITHERSBURG, MD, 20899, United States

Place of Performance

Gaithersburg, MD

NAICS

Semiconductor Machinery Manufacturing (333242)

PSC

Laboratory Equipment And Supplies (6640)

Set Aside

No set aside specified

Timeline

1
Posted
Jun 12, 2026
2
Response Deadline
Jun 26, 2026, 4:00 PM

Qualification Details

Fit reasons
  • NAICS alignment with historical contract wins in similar service areas.
  • Scope strongly matches core technical capabilities and delivery model.
Risks
  • Past performance thresholds may require one additional teaming partner.
  • Potential clarification needed on staffing minimums before bid/no-bid.
Next steps

Validate eligibility requirements, assign capture owner, and schedule partner outreach to confirm teaming strategy before submission planning.

Quick Summary

The National Institute of Standards and Technology (NIST), under the Department of Commerce, is conducting market research through a Name Brand Only Sources Sought Notice to identify sources capable of providing a TPT manual wire bonder. This notice aims to gather information for future procurement planning. Responses are due by June 26, 2026, at 4:00 PM ET.

Scope of Requirement

NIST requires a TPT manual wire bonder with specific technical and operational interface capabilities. Key specifications include:

  • Bonding Modes: Capable of wedge, ball, and ribbon wire bonding, reconfigurable within 5 minutes.
  • Operation: Manual control for X, Y, and Z positioning.
  • Wire Support: Supports gold and aluminum wire diameters from 17 um to 75 um, and ribbon wire width from 20 um to 250 um.
  • Ultrasonic System: Transducer with PLL control (60-70 kHz), power output 0-10 W, bond time 0-20,000 ms, bond force 5-200 cN.
  • Physical Features: 90-degree wire feed angle, motorized clamp, throat depth >= 165 mm, fine table motion >= 15mm.
  • Temperature Control: Controller with upper limit >= 250 C and +/- 1C accuracy.
  • Size: Tabletop size smaller than 600 x 600 x 300 mm.
  • Interface: Integrated operator interface with display, storage for at least 20 bonding programs, and direct adjustment of bond parameters.

Response Requirements

Interested parties should submit the following information:

  • Company Details: Complete name, address, contact information (name, email, phone), and Unique Entity ID (UEI) if registered in SAM.gov.
  • Capability Statement: Details on how your company's offerings meet or exceed NIST's minimum requirements.
  • Reseller Authorization: Confirmation of authorized reseller status with evidence.
  • Feedback on Requirements: Identify any unduly restrictive aspects of the requirements and suggest ways to encourage small business participation.
  • Business Size: Indicate if your company is a small or other than small business under NAICS 333242.
  • Alternative NAICS: Suggest a more appropriate NAICS code if applicable.
  • Existing Contracts: Identify any Federal Supply Schedule or other relevant contracts.
  • Experience: Describe your firm's experience providing similar products/services.
  • Engagement: State if you wish to engage for a better understanding of the requirement.

Contract & Timeline

  • Type: Sources Sought / Market Research
  • NAICS: 333242 (Semiconductor Machinery Manufacturing)
  • Product Service Code: 6640 (Laboratory Equipment And Supplies)
  • Set-Aside: None specified (market research stage)
  • Response Due: June 26, 2026, 4:00 PM ET
  • Questions Due: June 18, 2026, 12:00 PM ET
  • Published: June 12, 2026

Important Notes

This is solely for market research and planning purposes. It is not a solicitation, request for quotation, or a commitment to award a contract. NIST will not reimburse respondents for any costs incurred.

People

Points of Contact

Elizabeth TimberlakePRIMARY

Files

Files

No files attached to this opportunity

Versions

Version 1Viewing
Sources Sought
Posted: Jun 12, 2026
TPT Manual Wire Bonder | GovScope